Sivers Semiconductors has moved to lock in senior leadership across both of its operating divisions, a shake-up unveiled on Thursday that the Swedish chipmaker frames as groundwork for the commercial ramp-up now taking shape.
At the Wireless unit, Marc Pegulu steps in as Managing Director on September 28, 2026. He brings more than 25 years of building profitable product businesses in RF, wireless and mixed-signal technologies. Pegulu takes the reins from Harish Krishnaswamy, who shifts to the group level as Chief Strategy Officer, where he will own the overarching corporate strategy. Krishnaswamy is a co-founder of MixComm, the specialist Sivers acquired in 2021.
Photonics Handover Runs Through Year-End
A parallel transition is under way in Photonics. David Clark assumes the VP of Engineering role on October 31, 2026, arriving with over 25 years of expertise spanning photonics, semiconductor packaging, development leadership and product marketing. He succeeds Andrew McKee, the division’s CTO and a co-founder of CST Global, which Sivers bought in 2017. McKee is retiring but will stay on through the end of 2026 to smooth the technical handover.
The appointments are designed to channel decades of management and industry experience into a scaling phase, with both divisions approaching key milestones in moving development programs into larger production volumes.
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Glasgow Investment Sets the Pace
That push has a concrete anchor: roughly two weeks ago, Sivers laid out a $30m strategic investment to expand its indium phosphide (InP) fabrication site in Glasgow, Scotland. The buildout is aimed at production runs for customers in optical networks and AI data centers. The expansion program is slated to begin in the second half of 2026 and be operational in the fourth quarter of 2027, lifting annual capacity beyond 100 million CW-DFB lasers.
Product momentum has been building alongside the capex plans. At the CIOE trade fair in September, the company showcased laser solutions for optical transceivers and AI data center deployment, including an O-band continuous-wave DFB laser chip rated at 100 mW and an eight-channel laser array. These components target the physical limits of copper interconnects in data transmission, with the arrays designed for optical networks running at 1.6 terabit speeds.
A Stock That Has Already Priced In High Hopes
Trading has been calm of late. The shares closed Friday at EUR 2.92, off 1.0% on the day. The longer view tells a different story: the stock has gained 652% since the start of the year, a run that reflects elevated expectations for the expansion plans. Whether the newly assembled leadership team can convert that goodwill into operational results will be judged against production progress in the quarters ahead.
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